INVITATION FOR TECHNOLOGICAL COOPERATION
Company: SAGANTEC ISRAEL LTD.
DOCUMENT STRUCTURE:
CONTACT DATA
| Organization: | SAGANTEC ISRAEL LTD. |
| Contact: |
Name: Mr. Eddie Shosev Position: CFO & Manager Israel |
| Address: |
3 Hayozma St. P.O.Box: 117 Tirat Carmel ISRAEL, 39100 Telephone: 04-8572781 Fax: 04-8572848 Email: Eddie@sagantec.co.il WEB site: www.sagantec.com |
GENERAL INFORMATION
Established: 1993
Type:
Industry
Ownership: Private
Core business
Components. Software for chip design. Developer of software tools
Employees: 55 Overview
SAGANTEC ISRAEL, part of the Fairchild organization, is primarily
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for VLSI designers to enable re-use of existing designs with the
latest manufacturing process technologies.
Main Markets:
Microelectronics industry.
engaged in the development, marketing and sales of Electronic
Design Automation software & cores. R&D centers are in Israel and
the Netherlands and sales is performed through a worldwide
network of distributors. SAGANTEC Israel has own offices in
Israel, Europe and the USA in support of its distributors and
clients. The typical clients for SAGANTEC are Asic Design houses
and Chip manufacturers.
SAGANTEC develops and markets software based solutions for reuse,
migration and re-implementation of integrated circuit (IC)
physical design in deep sub-micron (DSM) processes.
SAGANTEC enables semiconductor companies to very quickly
implement and introduce to the market System-on-Chip (SoC)
products in the latest available fabrication technologies.
SAGANTEC provides Integrated Circuit (IC) designers and
manufacturers a fast, automated way to implement physical
components, cores and libraries in new advanced DSM technologies.
In order to become and stay competitive in today's challenging
electronics markets, semiconductor companies are in a constant
drive to design and produce integrated circuits (ICs) and
introduce them to the market rapidly in the latest available
silicon fabrication technology.
Implementing a complex system-on-chip (SoC) design in a new
advanced silicon technology and delivering production silicon at
good yield rates becomes a tough challenge. The problem is that
real SoCs comprise manifold components from various sources:
There are cell-based logic blocks, various types of memory macros
& elements, hard IP cores such as CPUs and DSPs, analog & mixed
signal components, etc. Implementing all of these in one new
process technology, is impossible in today's shrinking market
windows: There is a clear and acute need for an automatic &
rapid way to implement all SoC components in any given new
silicon technology.
That is what SAGANTEC offers: a fast, automated way to implement
physical components, cores and libraries in new advanced DSM
technologies and thus enable fast introduction of SoC products
using latest available technologies. SAGANTEC solutions
encompass all physical design elements from the silicon
infrastructure level, such as standard-cell libraries, custom
libraries and memory libraries, through analog cells and
mixed-signal components, to large memory macros and full-blown IP
cores like CPUs & DSPs.
Sagantec solutions capture and maintain the inTEGRITY of an
existing, proven physical design, and automatically translate it
to a new set of silicon process manufacturing rules and
engineering rules, compacting and optimizing the circuit for any
given technology.
MATIMOP ADDRESS:
Liaison: Mr. Uzi Bar-Sadeh
Internet site: http://www.matimop.org.il
Email: uzi@matimop.org.il
Mail: POBox: 50364 Tel Aviv Israel 61 500
Fax: ++ 972 3 5177655