Bonding Tools Manufacturing. Expandable tools for the
semiconductor industry, including: capillaries, wedges, die
collets, blades, probes & accessories.
Employees: 600
Professionals: 70
Turnover (KUS$): 27,100
Market regions:
South East Asia, USA
Overview
KULICKE & SOFFA BONDING TOOLS LTD. (formerly MICRO-SWISS), a
Expertise
* Manufacturing of very small tools using EDM, GRINING and Click here to request more information, about this company (FOR COLLABORATION IN R&D. ONLY!)
Note - you have to be registered in this server to
request information. If you haven't done so
yet, please register in this server
Your requests will be forwarded to the developer, who
will contact you directly
You can also see the list of
documents you already requested more information about
subsidiary of Kulicke & Soffa Industries - is a leading high-tech
company, specializing in the development, production and
marketing of unique processes and tools, for micro-electronic
components production in the semiconductor industry.
The company's leading products are miniature, extremely accurate
bonding tools, made of unique hard ceramic and metal, used for
soldering gold, aluminum or copper wires during the assembly of
semiconductor. The company has developed a unique know-how in
design and manufacture of very small ceramic and metal tools,
including extremely complicated geometry designs using EDM,
electroplating, and grinding processes. The company's specialized
blade line is designed for accurate dicing of silicon and hard
materials.
K&S BONDING TOOLS' line of quality products includes the
following:
* Capillaries, Wedges: Miniature, precise tools made of extremely
hard materials, ceramic or metal, used for soldering extremely
thin aluminum, gold or copper wires (10-6 meter diameter).
* Die-Collects: Tools used for accurate placement of
semiconductor components.
* Tab Tools: Miniature punches used for micro-soldering of
components in the semiconductor production process.
* Four Point Probes: Precision tools for measuring electrical
resistance of silicon layers in the semiconductor production
process.
* Dicing Blades: Blades for dicing silicon and other components
in the micro-electronics industry.
Additionally, the company offers other complementary products and
accessories for semiconductor production (such as wafer frames
and magazines for different stages of IC packaging).
K&S BONDING TOOLS' customer base includes the world's largest
electronic component suppliers, including Motorola, Samsung,
Amkor, TI, HP, Toshiba, Sony and Sanyo.
ELECTROPLATING;
* Development of special designed tools and processes for
microelectronics
R&D technology:
Machining, EDM, Dicing
R&D applications:
Materials
R&D markets:
Microelectronics
Available R&D facilities
Annual R&D expenditure (MU$): 1,000
R&D employees: 25
R&D professionals: 15
Equipment:
Bonding Lab.
Dicing Lab.
