GENERAL INFORMATION
Established:  1993
Type:  Graduated from Technological Incubator
Ownership:  Private

Core business

Microelectronics packaging; special multi chip module technology.

Employees:  17
Main Markets:  Electronics Industry

Overview

MCL is engaged in the development and production of ceramic and
metal based advanced multilayer packages and substrates for the
electronics industry. Main applications are in advanced packaging
of high pin count components, System in Package (SiP), RF and
high power packaging applications.
The main attribute of the products is its superior thermal
properties, based on an advanced multilayer substrate having high
content of aluminum embedded in a ceramic-based dielectric
matrix.

MCL - Micro Components Ltd. has developed a revolutionary and
proprietary substrate technology named ALOX. ALOX is a unique
multilayer substrate technology developed for microelectronics
packaging applications.
The technology is protected by several patents.
In ALOX, no via drill and plating is required - the via is of
solid full aluminum and the dielectric is of a high quality
ceramic nature. The process is simple and low cost, and contains
a low number of process steps. The ALOX technology serves as a
wide technology platform, and can be
implemented in various electronics packaging applications such as
for RF, SiP, 3-D memory stacks, MEMS and high power modules and
components.

The advantages of ALOX substrates over the competition - either
laminate/build-up substrate based or ceramic based - are both in
technical
performance and in cost.

Main technical advantages:
* Superior thermal properties, due to embedded integral aluminum
heat-sink option: ceramic matrix, very thin, low profile.
* High speed, due to the special vias built of full aluminum of
very low inductance.
* Very high routing density - metal layers having copper signal
layers of <1/1 mil line/space.
* Option for building special features needed for RF
applications, strip lines, wave guide structures, controlled
impedance lines.
* Easy option for including integrated passives such as resistors
in the multilayer.

Cost advantages:
* Production costs are significantly lower relative to
competitive PCB-type substrate technologies, mainly due to lack
of the drilling and hole plating processes.
* Basically, ALOX provides a ceramic-based substrate, fabricated
by a minimal number of steps of PCB-like processes and
manufacturing techniques.

The Company is privately held, located in the northern part of
Israel, and having a sales office in Phoenix, AZ.

MCL is committed to the highest standards of quality and
reliability and is certified to ISO2000.

MCL has supplier relationships with several industry leaders, and
is set to produce production lots and prototype samples in a
short turnaround mode.