Innovative solutions for failure analysis and process monitoring
in the semiconductor industry. Product line is based on company's
dicovery of a unique microcleaving technology.
Employees: 27
Main Markets:
Fabs, Equipment and Material Suppliers, Research Institutes.
Overview
SELA - SEMICONDUCTOR ENGINEERING LABORATORIES LTD. founded in
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1992, produces automated sample preparation systems used
primarily by semiconductor manufacturers to prepare samples for
scanning electron microscopy (SEM) and transmission electron
microscopy (TEM). The information provided by these tools is
critical in developing new manufacturing processes, controlling
and diagnosing problems in existing processes. The bottleneck in
the feedback loop is often in the elaborate procedures required
for sample preparation. With manufacturing facilities capable of
producing millions of dollars worth of product per hour, every
minute counts. SELA's automated systems can reduce sample
preparation time from days to hours and from hours to minutes.
The economic benefits of automating sample preparation are
immediately apparent to SELA customers. 150 SELA systems are
currently in use worldwide. Many major semiconductor
manufacturers, including Motorola, Hewlett-Packard (Agilent),
National Semiconductor, and France Telecom's CNET laboratory use
SELA systems to dramatically reduce defect analysis turnaround
times in their research and development, process development,
failure analysis, and manufacturing quality control analytical
labs. More than 50 percent of SELA MC Series systems users have
ordered additional systems. In 1998, the SELA MC200
Microcleaving( system was selected by Semiconductor International
to receive its prestigious Editors' Choice Best Product Award.
SELA Microcleaving sample preparation services are also now
available through major analytical service laboratories.
SELA has developed automated tools for SEM sample preparation
that begin with a manually cleaved partial wafer and
automatically apply a sequence of precisely controlled cleaving
operations to yield a finished sample without requiring
polishing. The final Microcleaving step can be positioned with
submicron accuracy through the targeted feature. This process
provides two mirror-image cross sections with half of the target
on each side. The system includes provides a high-resolution
optical microscope to select the target location.
Similar to SELA's SEM preparation for final thinning, the
TEMstation( provides significant sample preparation time savings.
Conventional TEM sample preparation can literally take days. The
combination of Microcleaving, TEMstation pre-thinning, and FIB
can produce a finished sample in as little as an hour. It also
improves the reliability of the sample preparation process,
increases utilization of the TEM, and greatly reduces the skill
level required of the operator. With time-to-analysis measured in
hours rather than days, the ultrahigh resolution imaging and
analysis capabilities of TEM are made feasable for process
control as well as failure analysis.
SELA has recently released navigation software to enable
operators to automatically drive to defects using coordinates
provided by an inline inspection system. Also under development
are software routines to plan cleaving sequences for multiple
targets. SELA will continue to set industry standards for
advanced tools and technology for the automation of sample
preparation and the analytical lab, striving for minimum time
between product conception and delivery.
