GENERAL INFORMATION
Established:  1994
Type:  Industry
Ownership:  Private
Parent:  Tessera Technologies Inc. (Nasdaq:TSRA)

Core business

Components. Wafer Level Chip Size Packaging for various
applications: Memory, Image sensors, IPC, Smart Cards.
Wafer-level packaging center.

Employees:  85
Market regions:  Europe, USA, SEA
Main Markets:  Semiconductor companies,smart card manufacturers, CCD and optical device developers.

Overview

TESSERA ISRAEL LTD. (formerly SHELLCASE LTD.) develops and
manufactures innovative packages for integrated circuits. Founded
in 1993, SHELLCASE is a pioneer in Chip Size Packaging (CSP)
technology and one of the few firms in the industry to offer
complete, reliability-tested wafer-level CSP capability. The
company's headquarters, R&D laboratories and production line are
located in a 15,000-square-foot facility in Jerusalem, Israel.

SHELLCASE was established to research and develop innovative
wafer level packaging technology for integrated circuits. The
company's ShellBGA and ShellOP packages are used for a long list
of device types. Among these are: the ShellBGA package for
memories, logic, integrated passive, RF ICs, mixed signal, smart
cards etc., and the ShellOP for CCD, CMOS, linear and array
image sensors and other light detection devices. SHELLCASE's
ShellOP package is the first and only wafer-level CSP package
available today for image sensors and light detection devices.
The company is offering its ShellBGA and ShellOP wafer-level
packaging technologies for licensing by captive and/or contract
packaging houses, as well as in-house contract packaging
services. SHELLCASE's most recent licensing agreement was signed
in June with a Taiwanese contract packaging house. The company is
publicly held and its common stock is traded under the symbol SSD
on the Canadian Stock Exchange.

SHELLCASE has completed development of its next-generation
platform for optical devices, called ShellUltraThin (ShellUT).

The new ultra-thin packaging platform brings a much needed
solution for IC and module makers, who are faced with the
constant need to miniaturize while at the same time provide
additional functionality.

The new WLCSP-based ShellUTplatform provides X/Y dimensions
identical to the original chip and a reduced thickness. ShellUT
utilizes an innovative glass-silicon structure, including a
cavity between the image area and the glass to enable
image-sensing capabilities through the packaging structure,
allowing for the use of micro-lenses.

In 2005 SHELLCASE Ltd. was acquired by Tessera Technologies Inc.
and became its R&D Center in Israel.