INVITATION FOR TECHNOLOGICAL COOPERATION

Company: CEVA DSP CORES ISRAEL LTD.

DOCUMENT STRUCTURE:


CONTACT DATA
Organization: CEVA DSP CORES ISRAEL LTD.
Contact: Name: Mr. Menachem Stern
Position: VP Research & Development
Address: 2 Maskit St.
P.O.Box: 2068
Herzliya
ISRAEL, 46120
Telephone: 09-9613700
Fax: 09-9613800
Email: arik.michal@ceva-dsp.com
WEB site: www.ceva-dsp.com


GENERAL INFORMATION
Established:  2002
Ownership:  Private
Parent:  A member of DSP Group

Core business

A leading licensor of DSP cores and related Platform-level
Intellectual Property (IP) to the semiconductor and electronics
industry

Employees:  67
Professionals:  45

Overview

CEVA DSP CORES ISRAEL LTD. (formerly PARTHUSCEVA ISRAEL) is an
Israeli division of US based PARTHUSCEVA Inc., which was formed
in 2002 through the merger of Ceva, the former DSP cores
licensing business of DSP Group and Parthus, a provider of
platform-level IP for the wireless and consumer electronics
market.

PARTHUSCEVA is the leading independent licensor of programmable
DSP (Digital Signal Processing) cores and application specific
platform IP solutions with strong penetration of many of the
world's largest semiconductor and electronic companies.
PARTHUSCEVA markets one of the largest portfolios of SIP
(Semiconductor Intellectual Property) in the industry on three
levels: Programmable DSP cores (SmartCores), Integrated SoC
sub-systems (XpertDSP) and Application-Specific platform IP.

PARTHUSCEVA's portfolio of programmable DSP cores are used in a
wide variety of electronic devices from digital cellular
telephones, to modems, to hard disk drive controllers, MP3
players, voice over packet products and digital cameras.
PARTHUSCEVA's highly integrated DSP-based subsystems incorporate
a large set of system interface peripheral components, together
with a full set of software and hardware development tools which
lower the complexity, cost of development, and time-to-market for
SoC designs.

PARTHUSCEVA's application specific platforms are silicon-proven
IP solutions spanning markets including broadband wireless
solutions (2G, 2.5G, 3G), wireline solutions (multi-serial
comms), wireless local area networking solutions (802.11,
Bluetooth) and vital application and multimedia solutions,
including audio, multimedia, GPS and Smartphone technologies.



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